This International Workshop on Interfaces will provide a forum for discussing the fundamental properties of materials interfaces in a wide spectrum of applications, including composites, microelectronic packaging, materials joining, functionally graded systems, thin films, and biomaterials. Through new insights gained from researchers with very diverse backgrounds and points of view, we hope to advance our understanding of the common aspects of materials interfaces in these widely differing fields.
- Abstract Deadline:
- April 15, 2008
- Hotel Booking Deadline:
- May 1, 2008
- Registration Deadline:
- May 1, 2008 (for discounted fee)