Former Ritchie Group Members



Holly Barth, Ph.D.

Joseph Lemberg, Ph.D.

Alessandra Carriero, Ph.D., post-doc

Björn Busse, Ph. D., post-doc

Amanda Runciman, M.S.

Maximilien Launey, Ph.D., post-doc

Sophi Martin, Ph.D.


Daan Hein Alsem, Ph.D., Hummingbird Scientific, daan_alsem@hummingbirdscientific.com

Beverly Asoo, graduate student, UCSB; bevasoo@engineering.ucsb.edu

Igor Altenberger

K. Badrinarayanan, Engineer, Cypress Semiconductor, San Jose, CA; bdk@cypress.com

Guive Balooch, Ph.D.

Monica Barney

Sabine Bechtle, Hamburg University of Technology

Terrence Becker , Research Analyst, Salomon Smith Barney, New York, NY, Tel: 415-617-8546

Chris Bencher, Staff Scientist, Applied Materials Inc., Santa Clara, CA

Brad Boyce, Sandia National Laboratories, P.O. Box 5800, MS 0889, Albuquerque, NM 87185-0889 (Tel:505-845-7525); blboyce@sandia.gov

Chiara Bosi , cbosi@ing.unife.it

R.M. Cannon, Ph.D., deceased

Da Chen; da_chen@hotmail.com  deceased

Don Bloyer, Seagate Technologies, Bloomington, MN; don_r_bloyer@notes.seagate.com

Aindrea McKelvey Campbell , Materials Science Department, Ford Research Laboratory, Dearborn, MI (Tel:313-594-7398); acampb24@ford.com

Josh Campbell , Metal Fabricating Division, General Motors, Troy, MI (Tel:483-610-116); josh.campbell@gm.com

Jim Card

Heeman Choe, Beker Hughes, Heeman.Choe@hugheschris.com

Mike Ciavarella; M.Ciavarella@soton.ac.uk

W. Craig Carter, Professor of Materials Science, MIT; wcraig@pruffle.nist.gov

Reiner Dauskardt, Assoc. Prof. of Materials Science, Stanford University; dauskardt@stanford.edu

V. B. Dutta, Advenient Technology, CA

Larry Edelson

James W. Foulk III

R. Fuquen-Molano, Timken Company, Canton, OH

Yong Gao
 

Thomas George, JPL

Christopher J. Gilbert, McKensey & Co., Inc., New York (Tel:212-242-4155); Chris_Gilbert@McKinsey.com

Inhoy Gu, Professor of Applied Mechanics, Chung-Ang University, Korea; ihgu@chungang.edu

Hamid N. Hashemi, Prof. Mechanical Engineering, Northeastern University; hamid@coe.neu.edu

Fred Haubensak, Staff Scientist, Intel Corporation

Rebecca Havens

H. F. Hayashigatani

Mark Hoffman, Ass. Prof., Mater. Sci., University of NSW, Australia; Mark.Hoffman@unsw.edu.au

Moon-Hee Hong, Agency for Defense Development, Yuseong, Korea; mhhong@sunam.kreonet.re.kr

Valentina Imbeni, Ph.D.

Avinash Kant, Rockwell Semiconductor Systems, Newport Beach; avinash.kant@rss.rockwell.com

Tony Keslinke

Do Kyung Kim, Ph.D.

Kurt Koester, Ph.D.

Desi Kovar, Ass. Professor of Ceramics, University of Texas in Austin; dkovar@mail.utexas.edu

Jamie J. Kruzic, Ph.D. , Department of Mechanical Engineering, 204 Rogers Hall, Oregon State University, Corvallis, OR 97331-6001, Tel. 541-737-7027, email: kruzicj@engr.orst.edu

Aaron Kueck, Ph.D

Scott Lillibridge

Tsann Lin

Julian M. Lippmann

Ellis Liu

Jim Mason, Ass. Prof. Aero. & Mech.Eng. University of Notre Dame; James.J.Mason.12@nd.edu

Ankur Mohan, Standford University; amohan@leland.stanford.edu

Angela Meyer, Exponent (Failure Analysis Associates), Menlo Park, CA

J. Finis McCarver, Consultant, Applied Technical Services, Atlanta; ats@atslab.com

Rich McClaughry, General Motors, Flint, MI

James McNaney, Lawrence Livermore National Laboratory, CA (Tel: (925)423-9335); mcnaney1@llnl.gov

John C. McNulty, Assistant Research Engineer, UCSB (Tel: (805)893-4341); johnm@engineering.ucsb.edu

C. M. Moss

Chris Muhlstein  The Pennsylvania State University, Department of Materials Science and Engineering, 310 Steidle Building, University Park, PA 16802. phone: 814-865-1523; fax: 814-865-2917; email: muhlstein@matse.psu.edu

Laxman Murugesh, Staff Scientist, Applied Materials Inc., Santa Clara, CA
 
Ravi Nalla, Ph.D. ,  Intel

Rachel Neuendorf

Tae-Sung Oh, Professor of Materials Science, Hong Ik University, Seoul, Korea;

Raj Pendse

Jan O. Peters, Technical University Hamburg-Harburg, Hamburg, Germany (Tel: 49-(40)42878-2617);j.o.peters@tu-harburg.de

R. N. Petrany, Colorstrip, Inc., Richmond, CA

Mark Ritter, Instron Corporation, Canton, MA

Scott Robertson, Cordis Corporation, Fremont, CA

Olaf Roder; olaf.roder@muc.mtu.dasa.de

A. Sakaida, Ass. Prof. Mech. Eng., Akaski College of Technology, Kyoto, Japan

Valeska Schroeder, Hardware Design Engineer, Hewlett-Packard Company, Palo Alto, CA (Tel: (650)857-4795); valeska_schroeder2@hp.com

Jianku Shang, Assoc. Prof. of Materials Science, Univ. Illinois-Urbana; j-shang@staff.uiuc.edu

Toshihiro Shimizu, Ph.D., visiting scholar

Kiyoshi Shirato

Jessica Stankiewicz

Chang Min Suh, Prof. Mech, Eng., Kyungpook National University, Taegu, Korea

Luling Sun, M.S.

Subra Suresh, R.P. Simmons Professor of Materials Science, MIT; ssuresh@mit.gov

Tohru Suzuki, National Institute for Materials Science, Materials Engineering Laboratory, Intelligent Materials Research Group, 1-2-1 Sengen, Tsukuba, Ibaraki 305-0047, Japan (Tel: +81-298-59-2459, Fax: +81-298-59-2401) SUZUKI.Tohru@nims.go.jp

Raj Thankappan

A.W. Thompson, Ph.D

John Toplosky

Ronan Le Toquin , University of Rennes, France; letoquin_r@yahoo.com

Hiroshi Tsuda, Nat. Inst. Mater. Chem. Res., AIST, MITI, Tsukuba, Japan; tsuda@nimc.go.jp

J.-L. Tzou

K. T. Venkateswara Rao, Manager R&D, Guidant Corp; krao@guidant.com

Malcolm Ward-Close; DERA, UK

Brandon Yoe, R&D Engineer, Guidant Corp., (Tel:650-464-3851)

Gun Young Lee   Naval Research Laboratory, Code 6176 Bldg 207, 4555 Overlook Avenue SW, Washington, DC 20375-5320, Phone: (202) 767-5342; Fax: (202) 767-3321; Email: gunlee@ccs.nrl.navy.mil

Weikang Yu, deceased

Rong Yuan

Elliot Zaken

Alexander Ziegler , Lawrence Livermore National Laboratory, Tel: 925-422-8070, aziegler@llnl.gov

Gerry Zamiski, Metallurgical Consultant, Los Angeles


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Last updated 03/06